may 2011 doc id 15664 rev 4 1/7 7 STPS15L30CDJF low drop power schottky rectifier features very small conduction losses negligible switching losses extremely fast switching low forward voltage drop low thermal resistance high avalanche capability specified description dual center tap schottky re ctifier suited for switch mode power supply and high frequency dc to dc converters. packaged in powerflat?, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. tm: powerflat is a trademark of stmicroelectronics table 1. device summary symbol value i f(av) 2 x 7.5 a v rrm 30 v t j (max) 150 c v f (typ) 0.34 v k a1 a2 a1 k k a2 a1 a2 powerflat 5x6 STPS15L30CDJF www.st.com
characteristics STPS15L30CDJF 2/7 doc id 15664 rev 4 1 characteristics when diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.27 x i f(av) + 0.016 i f 2 (rms) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 30 v i f(rms) forward rms current 10 a i f(av) average forward current = 0.5 t c = 140 c per diode 7.5 a per device 15 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a i rrm peak repetitive reverse current t p = 2 s square f= 1 khz 1 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 2800 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink 150 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case per diode 2.5 c/w total 1.6 r th(c) coupling 0.7 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm --1ma t j = 125 c - 70 140 ma v f (1) forward voltage drop t j = 25 c i f = 7.5 a - - 0.48 v t j = 125 c i f = 7.5 a - 0.34 0.39 t j = 25 c i f = 15 a - - 0.57 t j = 125 c i f = 15 a - 0.44 0.51 dptot dtj < 1 rth(j-a)
STPS15L30CDJF characteristics doc id 15664 rev 4 3/7 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) p f(av) (w) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 012345678910 =0.05 =0.1 =0.2 =0.5 =1 t =tp/t tp i f(av) (a) i f(av) (a) 0 1 2 3 4 5 6 7 8 9 0 25 50 75 100 125 150 t =tp/t tp t amb (c) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p p (25c) arm (tj) arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 6. relative variation of thermal impedance, junction to case, versus pulse duration i m (a) 0 10 20 30 40 50 60 70 80 90 100 110 120 1.e-03 1.e-02 1.e-01 1.e+00 t c =25c t c =75c t c =125c i m t =0.5 t(s) z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse tp(s)
characteristics STPS15L30CDJF 4/7 doc id 15664 rev 4 figure 7. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 8. junction capacitance versus reverse voltage applied (typical values, per diode) i r (ma) 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0 5 10 15 20 25 30 t j =150c t j =125c t j =25c t j =100c t j =75c t j =50c v r (v) c(pf) 100 1000 1 10 100 f=1mhz v osc =30mv rms t j =25c v r (v) figure 9. forward voltage drop versus forward current (per diode) figure 10. thermal resistance junction to ambient versus copper surface under each lead 0 2 4 6 8 10 12 14 16 18 20 0.0 0.1 0.2 0.3 0.4 0.5 0.6 i (a) fm t = 125 c (maximum values) j t = 125 c (typical values) j v (v) fm t = 25 c (maximum values) j rth(j-a)(c/w) 0 100 200 300 0 200 400 600 800 1000 s cu (mm2) epoxy printed board fr4 copper thickness = 35 m
STPS15L30CDJF package information doc id 15664 rev 4 5/7 2 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint (dimensions in mm) table 5. powerflat 5x6 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 1.00 0.031 0.039 a1 0.02 0.05 0.001 0.002 a2 0.25 0.010 b 0.30 0.50 0.012 0.020 d 5.20 0.205 d2 4.11 4.31 0.162 0.170 e 1.27 0.050 e 6.15 0.242 e2 3.50 3.70 0.138 0.146 l 0.50 0.80 0.020 0.031 k 1.275 1.575 0.050 0.062 d2 e2 k l b e d e a a1 a2 1.27 0.62 0.95 0.98 6.29 4.33 3.86 5.35 4.41
ordering information STPS15L30CDJF 6/7 doc id 15664 rev 4 figure 12. tape and reel specifications 3 ordering information 4 revision history dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 8.0 6.30 2.0 12.0 5.30 1.75 5.5 ? 1.55 ? 1.5 0.20 1.20 0.30 r 0.50 table 6. ordering information order code marking package weight base qty delivery mode STPS15L30CDJFtr ps15 l30c powerflat 5x6 0.095 g 3000 tape and reel table 7. document revision history date revision changes 13-may-2009 1 first issue. 09-nov-2009 2 updated table 1. 30-jul-2010 3 replace power qfn with powerflat. updated figure 9. 18-may-2011 4 added reference e in ta bl e 5 . updated package graphics. removed dash from order code and updated marking in ta b l e 6 . added figure 12.
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